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Solder
A broad variety of solder alloys have been investigated as potential replacements for tin lead solder. While there is broad agreement that there will be no drop in replacement for tin lead, two alloy families, tin-silver-copper (SnAgCu) and tin-copper (SnCu) seem to be generating the most interest.
The Solder Products Value Council has formally tested and the 96.5/3.0/0.5 SAC alloy be the lead free solder paste alloy of choice for the electronics industry. Download the Executive Summary here.
The National Institute of Standards and Technology maintains an extensive database of metallurgical properties.
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