IPC Standards

IPC is currently revising or has recently revised the following standards to address lead free assembly issues. Drafts and status of documents that are currently in revision can be accessed at www.ipc.org/status. For more information contact Jack Crawford, director of assembly technology.

• IPC-J-STD-001D: Requirements for Soldered Electrical & Electronic Assemblies
• IPC-J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
• IPC-J-STD-003B: Solderability Tests for Printed Boards
• IPC-J-STD-004A: Requirements for Soldering Fluxes
• IPC-HDBK-005: Guide to Solder Paste Assessment
• IPC-J-STD-005: Requirements for Soldering Pastes
• IPC-J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders
• IPC/JEDEC J-STD-020C: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Device
• J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
• IPC/JEDEC J-STD-033B: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
• IPC-A-610D: Acceptabililty of Electronic Assemblies
• IPC-4101B with Amendments 1 & 2: Specification for Base Materials for Rigid and Multilayer Printed Boards
• IPC-7351A: Generic Requirements for Surface Mount Design and Land Pattern Standard
• 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

Additionally, IPC has developed IPC-1066, a standard for the labeling of lead free electronics.

IPC's Environmental, Health and Safety Committee has developed a handbook (IPC-1065) on complying with Materials declarations requests for lead free and other materials of concern.